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Jacobs Senior Microelectronics Packaging Engineer in Severn, Maryland

Challenging Today. Reinventing Tomorrow.

We're invested in you and your success. Everything we do is more than just a project. It's our challenge as human beings, too. That's why we bring a thoughtful and collaborative approach to every one of our partnerships.

At Jacobs, we challenge the status quo and redefine how to solve the world's greatest challenges, transforming big ideas into intelligent solutions for a more connected, sustainable world.

Design your career with a company that inspires and empowers you to deliver your best work so you can evolve, grow and succeed – today and into tomorrow

Your Impact:

Duties :

  • Participate in Microelectronics product development activities including packaging concepts, preliminary/detailed board design and package road mapping efforts.

  • Optimize thermal performance, material compatibility, and reliability utilizing engineering analysis and optimization techniques.

  • Review electronics packaging designs as they progress through development, qualification, and production considering design for manufacturability, yield issues, and reliability.

  • Develop engineering qualification plans for requirements verification and risk reduction utilizing a combination of engineering analysis and environmental testing (Thermomechanical, Shock/vibe, humidity, other fatigue tests, and overstress testing).

  • Perform PCB level thermal analysis as well as system level thermal analysis.

  • Assess components and packages with physics of failure principles to identify key failure modes and recommend analysis to validate design decisions.

  • Process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics.

  • Develop technologies required for next generation packages.

  • Lead Mechanical and/or multi-disciplined teams in hardware development activities.

  • Develop and conduct testing to validate engineering analysis models.

  • Develop and execute manufacturing process validation plans.

  • Design and qualify complex tooling to facilitate product assembly.

  • Design and conduct laboratory experiments to evaluate material selections and/or advanced electronic packaging manufacturing processes.

  • Accelerated life test planning and execution of package through sub-assembly level.

  • Participate in product design reviews to provide input on functional requirements, product designs, schedules, or potential problems.

  • Assist in creating cost estimates for related activities.

  • Collaboration with division leadership to ensure that group technical capabilities align with strategic objectives.

Here’s What You’ll Need:

Required :

  • ABILITY TO OBTAIN AND MAINTAIN A SECURITY CLEARANCE.

  • Bachelor's degree in mechanical engineering (or similar) with 8+ years of experience or a master’s degree with 6+ years of experience.

  • Experience with packaging approaches used today and understanding of the gaps in today’s technologies and approaches, ongoing research in advanced packaging, ongoing development across industry, and associated goals and timelines.

  • Demonstrated understanding and experience in the selection, procurement, manufacture, use and testing/screening of high reliability microelectronics.

  • Ability to work in a dynamic environment with cross-functional teams across with design engineers, line management, and project management.

  • Effective time management and prioritization skills; Must be able to plan and execute multiple technical tasks concurrently.

  • Understanding of impacts of complex packaging architectures on circuit performance including speed, thermal, etc.

  • Excellent communication and documentation skills.

  • Good problem-solving skills.

  • Familiarity with printed wiring board (PWB) fabrication and electronics assembly processes.

  • Experience resolving qualification and production failures.

  • Understanding of principles for performing mechanical analysis including structural, thermal, or vibration.

Preferred :

  • Current TS/SCI clearance with poly.

  • Understanding and experience with design, development and testing of advanced packaging techniques. This includes conventional packaging techniques like ASIC, BGA, 2.5D / 3D heterogeneous integration, and familiarity with commonly available supply chain for fabrication, assembly, packaging and test of multi-chip-modules (MCMs) and System-in-Package (SiP) for digital and RF products.

  • Understanding of commercial microelectronics fabrication process technologies, including standard substrates (organic, silicon and glass) and PCB manufacturing processes.

  • Hands-on manufacturing and machine shop experience.

  • Experience creating and executing DOE (design of experiments).

  • Post wafer fabrication processes expertise.

  • CAD experience in SOLIDWORKS.

  • Reverse engineering of electronics for functionality and manufacturing techniques.

#rapidsolutions

Clearance: Must be able obtain and maintain a security clearance (minimum SECRET).

Clearance processing will be completed by the U.S. Government. Factors considered for a U.S. Government Security Clearance include but are not limited:

-U.S. Citizenship (Required)

-Favorable Criminal History Check

-Education Verification

-Abuse/Illegal Drug Use

-Credit Check

-Subject Interview

Location(s): Severn, MD

Jacobs is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, religion, creed, color, national origin, ancestry, sex (including pregnancy, childbirth, breastfeeding, or medical conditions related to pregnancy, childbirth, or breastfeeding), age, medical condition, marital or domestic partner status, sexual orientation, gender, gender identity, gender expression and transgender status, mental disability or physical disability, genetic information, military or veteran status, citizenship, low-income status or any other status or characteristic protected by applicable law. Learn more about your rights under Federal EEO laws (https://www.dol.gov/ofccp/regs/compliance/posters/pdf/eeopost.pdf) and supplemental language (https://www.eeoc.gov/sites/default/files/migrated_files/employers/eeoc_gina_supplement.pdf) .

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